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ASE Technology Holding Co., Ltd.

ASX· NYSE
TWTW
$41.60+4.04%
2026-09-18

Financials

Valuation Metrics

ASE Technology Holding Co., Ltd.'s Market Cap is $91.28B. Ranked #186 of 3,121 in US market (top 6%), #130 of 1,658 on NYSE (top 8%), #15 of 74 in Semiconductors & Semiconductor Equipment (top 20%) by Market Cap.

Investment Metrics(as of 2026-09-19)

MetricValue
Size
Market Cap$91.28B
Revenue$22.99B
Net Income$1.96B
Total Assets$34.29B
Net Assets$12.46B
Employees96,436
Value
P/E46.46x
P/B7.33x
PEG0.57x
P/S3.97x
EV/EBITDA19.38x
FCF Yield-8.50%
Profitability
ROE15.77%
ROA5.73%
Op. Margin9.78%
Revenue Growth16.61%
Earnings Growth81.01%
Financial Health
Debt Ratio167.56%
Total Debt$9.49B
FCF$-7.76B
Cash$2.92B
Current Ratio1.07x
Net Debt/EBITDA1.30x
Dividend
Div. Yield0.82%
Div. Growth1.03%
Performance
1Y Return262.73%
1M Return16.67%
From 52W High-8.60%
1Y MDD-31.03%
Trading
Volume6,302,677 shares
Trading Value$259M

Company Info

CEO Jason Chang
Employees 96,436
HQ Kaohsiung, TW

Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.