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Aehr Test Systems

AEHR· NASDAQ
$93.49+3.25%
2026-09-18

Financials

Valuation Metrics

Aehr Test Systems's Market Cap is $3.05B. At end of 2025 it was $620M. Ranked #1750 of 3,121 in US market (top 56%), #626 of 1,463 on NASDAQ (top 43%), #56 of 74 in Semiconductors & Semiconductor Equipment (top 76%) by Market Cap.

Investment Metrics(as of 2026-09-18)

MetricValue
Size
Market Cap$3.05B
Revenue$51M
Net Income$-7M
Total Assets$247M
Net Assets$220M
Employees138
Value
P/B13.89x
P/S59.90x
FCF Yield-0.18%
Profitability
ROE-3.25%
ROA-2.89%
Op. Margin-27.80%
Revenue Growth-13.65%
Financial Health
Debt Ratio12.38%
Total Debt$10M
FCF$-5M
Cash$116M
Current Ratio10.33x
Performance
1Y Return205.82%
1M Return-13.40%
From 52W High-36.57%
1Y MDD-47.62%
Trading
Volume1,883,354 shares
Trading Value$172M
Per Share
EPS$-0.22
BPS$6.73

Company Info

CEO Gayn Erickson
Employees 138
HQ Fremont, US

Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.