Aehr Test Systems
Financials
Valuation Metrics
Aehr Test Systems's Market Cap is $3.05B. At end of 2025 it was $620M. Ranked #1750 of 3,121 in US market (top 56%), #626 of 1,463 on NASDAQ (top 43%), #56 of 74 in Semiconductors & Semiconductor Equipment (top 76%) by Market Cap.
Investment Metrics(as of 2026-09-18)
| Metric | Value | Rank |
|---|---|---|
| Size | ||
| Market Cap | $3.05B | US#1,750/3,121 Sec#56/74 |
| Revenue | $51M | US#2,774/3,121 Sec#72/74 |
| Net Income | $-7M | US—/3,121 Sec—/74 |
| Total Assets | $247M | US#2,962/3,121 Sec#72/74 |
| Net Assets | $220M | US#2,655/3,121 Sec#72/74 |
| Employees | 138 | US#2,573/3,121 Sec#70/74 |
| Value | ||
| P/B | 13.89x | US#2,711/3,121 Sec#60/74 |
| P/S | 59.90x | US#2,925/3,121 Sec#73/74 |
| FCF Yield | -0.18% | US—/3,121 Sec—/74 |
| Profitability | ||
| ROE | -3.25% | US#2,228/3,121 Sec#57/74 |
| ROA | -2.89% | US#2,434/3,121 Sec#59/74 |
| Op. Margin | -27.80% | US#2,634/3,121 Sec#69/74 |
| Revenue Growth | -13.65% | US#2,646/3,121 Sec#73/74 |
| Financial Health | ||
| Debt Ratio | 12.38% | US#140/3,121 Sec#7/74 |
| Total Debt | $10M | US#2,835/3,121 Sec#64/74 |
| FCF | $-5M | US#2,354/3,121 Sec#58/74 |
| Cash | $116M | US#2,123/3,121 Sec#61/74 |
| Current Ratio | 10.33x | US#246/3,121 Sec#5/74 |
| Performance | ||
| 1Y Return | 205.82% | US#58/3,121 Sec#13/74 |
| 1M Return | -13.40% | US#3,062/3,121 Sec#73/74 |
| From 52W High | -36.57% | US#2,421/3,121 Sec#41/74 |
| 1Y MDD | -47.62% | US#2,350/3,121 Sec#46/74 |
| Trading | ||
| Volume | 1,883,354 shares | US#718/3,121 Sec#30/74 |
| Trading Value | $172M | US#431/3,121 Sec#31/74 |
| Per Share | ||
| EPS | $-0.22 | US—/3,121 Sec—/74 |
| BPS | $6.73 | US#2,123/3,121 Sec#61/74 |
Company Info
Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.