Aehr Test Systems
Financials
Valuation Metrics
Aehr Test Systems's Market Cap is $1.68B. At end of 2025 it was $620M. Ranked #2047 of 3,118 in US market (top 66%), #779 of 1,474 on NASDAQ (top 53%), #63 of 73 in Semiconductors & Semiconductor Equipment (top 86%) by Market Cap.
Investment Metrics(as of 2026-11-02)
| Metric | Value | Rank |
|---|---|---|
| Size | ||
| Market Cap | $1.68B | US#2,047/3,118 Sec#63/73 |
| Revenue | $51M | US#2,741/3,118 Sec#72/73 |
| Net Income | $-7M | US—/3,118 Sec—/73 |
| Total Assets | $247M | US#2,945/3,118 Sec#72/73 |
| Net Assets | $220M | US#2,638/3,118 Sec#72/73 |
| Employees | 138 | US#2,558/3,118 Sec#70/73 |
| Value | ||
| P/B | 7.65x | US#2,538/3,118 Sec#54/73 |
| P/S | 32.99x | US#2,898/3,118 Sec#72/73 |
| FCF Yield | -0.32% | US—/3,118 Sec—/73 |
| Profitability | ||
| ROE | -3.25% | US#2,217/3,118 Sec#59/73 |
| ROA | -2.89% | US#2,424/3,118 Sec#60/73 |
| Op. Margin | -27.80% | US#2,605/3,118 Sec#69/73 |
| Revenue Growth | -13.65% | US#2,596/3,118 Sec#73/73 |
| Financial Health | ||
| Debt Ratio | 12.38% | US#136/3,118 Sec#7/73 |
| Total Debt | $10M | US#2,820/3,118 Sec#64/73 |
| FCF | $-5M | US#2,337/3,118 Sec#57/73 |
| Cash | $116M | US#2,117/3,118 Sec#61/73 |
| Current Ratio | 10.33x | US#234/3,118 Sec#5/73 |
| Performance | ||
| 1Y Return | 98.11% | US#101/3,118 Sec#8/73 |
| 1M Return | -51.97% | US#3,088/3,118 Sec#72/73 |
| From 52W High | -65.07% | US#2,877/3,118 Sec#67/73 |
| 1Y MDD | -64.64% | US#2,776/3,118 Sec#66/73 |
| Trading | ||
| Volume | 3,112,007 shares | US#799/3,118 Sec#36/73 |
| Trading Value | $165M | US#747/3,118 Sec#43/73 |
| Per Share | ||
| EPS | $-0.22 | US—/3,118 Sec—/73 |
| BPS | $6.73 | US#2,115/3,118 Sec#61/73 |
Company Info
Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.