HANMI Semiconductor CO., LTD.
Financials
Valuation Metrics
HANMI Semiconductor CO., LTD.'s Market Cap is ₩18.3T. At end of 2025 it was ₩12.1T. Ranked #34 of 2,414 in KR market (top 1%), #34 of 781 on KOSPI (top 4%), #2 of 214 in Semiconductors & Semiconductor Equipment (top 0.9%) by Market Cap.
Investment Metrics(as of 2026-10-15)
| Metric | Value | Rank |
|---|---|---|
| Size | ||
| Market Cap | 18.32T KRW | KR#34/2,414 Sec#2/214 |
| Revenue | 551.31B KRW | KR#586/2,414 Sec#29/214 |
| Net Income | 222.03B KRW | KR#134/2,414 Sec#4/214 |
| Total Assets | 813.33B KRW | KR#544/2,414 Sec#22/214 |
| Net Assets | 690.33B KRW | KR#393/2,414 Sec#12/214 |
| Employees | 710 | KR#357/2,414 Sec#21/214 |
| Value | ||
| P/E | 82.51x | KR#1,480/2,414 Sec#127/214 |
| P/B | 26.54x | KR#2,402/2,414 Sec#213/214 |
| PEG | 22.74x | KR#832/2,414 Sec#69/214 |
| P/S | 33.23x | KR#2,359/2,414 Sec#210/214 |
| EV/EBITDA | 77.08x | KR#1,456/2,414 Sec#119/214 |
| FCF Yield | 0.84% | KR#1,154/2,414 Sec#91/214 |
| Profitability | ||
| ROE | 32.16% | KR#49/2,414 Sec#8/214 |
| ROA | 27.30% | KR#20/2,414 Sec#6/214 |
| Op. Margin | 42.49% | KR#20/2,414 Sec#4/214 |
| Revenue Growth | -19.58% | KR#2,116/2,414 Sec#182/214 |
| Earnings Growth | 3.63% | KR#804/2,414 Sec#69/214 |
| Financial Health | ||
| Debt Ratio | 17.82% | KR#320/2,414 Sec#26/214 |
| Total Debt | 14.03B KRW | KR#1,511/2,414 Sec#142/214 |
| FCF | 154.01B KRW | KR#135/2,414 Sec#3/214 |
| Cash | 276.24B KRW | KR#213/2,414 Sec#3/214 |
| Net Debt/EBITDA | -1.12x | KR#358/2,414 Sec#37/214 |
| Dividend | ||
| Div. Yield | 0.42% | KR#1,297/2,414 Sec#85/214 |
| Div. Growth | 11.11% | KR#569/2,414 Sec#44/214 |
| Performance | ||
| 1Y Return | 35.35% | KR#258/2,414 Sec#63/214 |
| 1M Return | -14.58% | KR#1,917/2,414 Sec#184/214 |
| From 52W High | -54.88% | KR#1,472/2,414 Sec#125/214 |
| 1Y MDD | -59.07% | KR#1,406/2,414 Sec#82/214 |
| Trading | ||
| Volume | 1,148,257 shares | KR#101/2,414 Sec#18/214 |
| Trading Value | 224.56B KRW | KR#9/2,414 Sec#3/214 |
| Foreign Own. | 8.54% | KR#531/2,414 Sec#57/214 |
| Per Share | ||
| EPS | 2,330 KRW | KR#410/2,414 Sec#38/214 |
| BPS | 7,243 KRW | KR#1,216/2,414 Sec#105/214 |
Company Info
Hanmi Semiconductor was established in 1980 to manufacture and sell semiconductor automation equipment, currently holding three affiliated companies. Its HBM TC BONDER enables 2.5D and 3D semiconductor configurations through wafer thermal compression bonding, while the 6-SIDE INSPECTION minimizes defect rates and improves yield with HBM chip vision inspection. The company is developing a hybrid bonder, a next-generation HBM chip stacking method, and strengthening its product development capabilities. Hanmi Semiconductor is headquartered in Seo-gu, Incheon Metropolitan City.