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HANMI Semiconductor CO., LTD.
042700· KOSPI· Information Technology· Semiconductors & Semiconductor Equipment
₩295,000-6.50%
2026-06-19
Price Chart
HANMI Semiconductor CO., LTD.+218.92%
Financials
Investment Metrics(as of 2026-06-19)
| Metric | Value |
|---|---|
| Size | |
| Market Cap | 28.12T KRW |
| Revenue | 480.19B KRW |
| Net Income | 178.29B KRW |
| Total Assets | 742.69B KRW |
| Net Assets | 635.87B KRW |
| Employees | 710 |
| Value | |
| P/E | 157.70x |
| P/B | 44.22x |
| P/S | 58.55x |
| EV/EBITDA | 146.97x |
| FCF Yield | 0.55% |
| Profitability | |
| ROE | 28.04% |
| ROA | 24.01% |
| Op. Margin | 39.61% |
| Revenue Growth | -65.46% |
| Earnings Growth | -65.24% |
| Financial Health | |
| Debt Ratio | 116.80% |
| Total Debt | 14.03B KRW |
| FCF | 154.01B KRW |
| Cash | 174.70B KRW |
| Current Ratio | 4.14x |
| Net Debt/EBITDA | -0.84x |
| Dividend | |
| Div. Yield | 0.25% |
| Div. Growth | 11.11% |
| Performance | |
| 1Y Return | 218.92% |
| 1M Return | 2.61% |
| From 52W High | -30.75% |
| 1Y MDD | -38.10% |
| Trading | |
| Volume | 4,123,802 shares |
| Foreign Own. | 6.19% |
| Per Share | |
| EPS | 1,867 KRW |
| BPS | 6,704 KRW |
Company Info
Hanmi Semiconductor was established in 1980 to manufacture and sell semiconductor automation equipment, currently holding three affiliated companies. Its HBM TC BONDER enables 2.5D and 3D semiconductor configurations through wafer thermal compression bonding, while the 6-SIDE INSPECTION minimizes defect rates and improves yield with HBM chip vision inspection. The company is developing a hybrid bonder, a next-generation HBM chip stacking method, and strengthening its product development capabilities. Hanmi Semiconductor is headquartered in Seo-gu, Incheon Metropolitan City.