HANMI Semiconductor CO., LTD.
Financials
Valuation Metrics
HANMI Semiconductor CO., LTD.'s Market Cap is ₩22.4T. At end of 2025 it was ₩12.1T. Ranked #34 of 2,421 in KR market (top 1%), #34 of 781 on KOSPI (top 4%), #2 of 214 in Semiconductors & Semiconductor Equipment (top 0.9%) by Market Cap.
Investment Metrics(as of 2026-09-18)
| Metric | Value | Rank |
|---|---|---|
| Size | ||
| Market Cap | 22.45T KRW | KR#34/2,421 Sec#2/214 |
| Revenue | 551.31B KRW | KR#586/2,421 Sec#29/214 |
| Net Income | 222.03B KRW | KR#134/2,421 Sec#4/214 |
| Total Assets | 813.33B KRW | KR#543/2,421 Sec#22/214 |
| Net Assets | 690.33B KRW | KR#393/2,421 Sec#12/214 |
| Employees | 710 | KR#357/2,421 Sec#21/214 |
| Value | ||
| P/E | 101.09x | KR#1,487/2,421 Sec#127/214 |
| P/B | 32.52x | KR#2,411/2,421 Sec#213/214 |
| PEG | 27.87x | KR#829/2,421 Sec#69/214 |
| P/S | 40.71x | KR#2,369/2,421 Sec#211/214 |
| EV/EBITDA | 94.70x | KR#1,482/2,421 Sec#123/214 |
| FCF Yield | 0.69% | KR#1,162/2,421 Sec#94/214 |
| Profitability | ||
| ROE | 32.16% | KR#49/2,421 Sec#8/214 |
| ROA | 27.30% | KR#20/2,421 Sec#6/214 |
| Op. Margin | 42.49% | KR#21/2,421 Sec#4/214 |
| Revenue Growth | -19.58% | KR#2,120/2,421 Sec#182/214 |
| Earnings Growth | 3.63% | KR#801/2,421 Sec#69/214 |
| Financial Health | ||
| Debt Ratio | 17.82% | KR#321/2,421 Sec#26/214 |
| Total Debt | 14.03B KRW | KR#1,516/2,421 Sec#142/214 |
| FCF | 154.01B KRW | KR#135/2,421 Sec#3/214 |
| Cash | 276.24B KRW | KR#213/2,421 Sec#3/214 |
| Net Debt/EBITDA | -1.12x | KR#358/2,421 Sec#37/214 |
| Dividend | ||
| Div. Yield | 0.34% | KR#1,309/2,421 Sec#86/214 |
| Div. Growth | 11.11% | KR#569/2,421 Sec#44/214 |
| Performance | ||
| 1Y Return | 149.73% | KR#77/2,421 Sec#27/214 |
| 1M Return | 6.56% | KR#652/2,421 Sec#88/214 |
| From 52W High | -44.72% | KR#1,148/2,421 Sec#89/214 |
| 1Y MDD | -59.07% | KR#1,421/2,421 Sec#86/214 |
| Trading | ||
| Volume | 454,409 shares | KR#255/2,421 Sec#37/214 |
| Trading Value | 106.49B KRW | KR#27/2,421 Sec#5/214 |
| Foreign Own. | 8.54% | KR#531/2,421 Sec#57/214 |
| Per Share | ||
| EPS | 2,330 KRW | KR#411/2,421 Sec#39/214 |
| BPS | 7,243 KRW | KR#1,209/2,421 Sec#106/214 |
Company Info
Hanmi Semiconductor was established in 1980 to manufacture and sell semiconductor automation equipment, currently holding three affiliated companies. Its HBM TC BONDER enables 2.5D and 3D semiconductor configurations through wafer thermal compression bonding, while the 6-SIDE INSPECTION minimizes defect rates and improves yield with HBM chip vision inspection. The company is developing a hybrid bonder, a next-generation HBM chip stacking method, and strengthening its product development capabilities. Hanmi Semiconductor is headquartered in Seo-gu, Incheon Metropolitan City.