HANMI Semiconductor CO., LTD.
Financials
Valuation Metrics
HANMI Semiconductor CO., LTD.'s Market Cap is ₩19.3T. At end of 2025 it was ₩12.1T. Ranked #37 of 2,436 in KR market (top 2%), #37 of 787 on KOSPI (top 5%), #2 of 214 in Semiconductors & Semiconductor Equipment (top 0.9%) by Market Cap.
Investment Metrics(as of 2026-08-04)
| Metric | Value | Rank |
|---|---|---|
| Size | ||
| Market Cap | 19.35T KRW | KR#37/2,436 Sec#2/214 |
| Revenue | 480.19B KRW | KR#623/2,436 Sec#33/214 |
| Net Income | 178.29B KRW | KR#145/2,436 Sec#3/214 |
| Total Assets | 742.69B KRW | KR#562/2,436 Sec#22/214 |
| Net Assets | 635.87B KRW | KR#406/2,436 Sec#13/214 |
| Employees | 710 | KR#355/2,436 Sec#21/214 |
| Value | ||
| P/E | 108.52x | KR#1,443/2,436 Sec#120/214 |
| P/B | 30.43x | KR#2,398/2,436 Sec#213/214 |
| P/S | 40.29x | KR#2,362/2,436 Sec#212/214 |
| EV/EBITDA | 100.87x | KR#1,464/2,436 Sec#115/214 |
| FCF Yield | 0.80% | KR#1,158/2,436 Sec#91/214 |
| Profitability | ||
| ROE | 28.04% | KR#54/2,436 Sec#8/214 |
| ROA | 24.01% | KR#19/2,436 Sec#3/214 |
| Op. Margin | 39.61% | KR#26/2,436 Sec#4/214 |
| Revenue Growth | -65.46% | KR#2,320/2,436 Sec#204/214 |
| Earnings Growth | -65.24% | KR#1,265/2,436 Sec#94/214 |
| Financial Health | ||
| Debt Ratio | 116.80% | KR#587/2,436 Sec#49/214 |
| Total Debt | 14.03B KRW | KR#1,502/2,436 Sec#139/214 |
| FCF | 154.01B KRW | KR#133/2,436 Sec#3/214 |
| Cash | 174.70B KRW | KR#302/2,436 Sec#8/214 |
| Current Ratio | 4.14x | KR#389/2,436 Sec#40/214 |
| Net Debt/EBITDA | -0.84x | KR#499/2,436 Sec#48/214 |
| Dividend | ||
| Div. Yield | 0.40% | KR#1,305/2,436 Sec#89/214 |
| Div. Growth | 11.11% | KR#554/2,436 Sec#43/214 |
| Performance | ||
| 1Y Return | 133.87% | KR#83/2,436 Sec#28/214 |
| 1M Return | -12.69% | KR#1,918/2,436 Sec#118/214 |
| From 52W High | -52.35% | KR#1,311/2,436 Sec#91/214 |
| 1Y MDD | -59.07% | KR#1,354/2,436 Sec#87/214 |
| Trading | ||
| Volume | 865,477 shares | KR#157/2,436 Sec#18/214 |
| Foreign Own. | 8.21% | KR#558/2,436 Sec#60/214 |
| Per Share | ||
| EPS | 1,867 KRW | KR#417/2,436 Sec#40/214 |
| BPS | 6,704 KRW | KR#1,217/2,436 Sec#104/214 |
Company Info
Hanmi Semiconductor was established in 1980 to manufacture and sell semiconductor automation equipment, currently holding three affiliated companies. Its HBM TC BONDER enables 2.5D and 3D semiconductor configurations through wafer thermal compression bonding, while the 6-SIDE INSPECTION minimizes defect rates and improves yield with HBM chip vision inspection. The company is developing a hybrid bonder, a next-generation HBM chip stacking method, and strengthening its product development capabilities. Hanmi Semiconductor is headquartered in Seo-gu, Incheon Metropolitan City.